AI :Auto-Insertion 自動(dòng)插件
AQL :acceptable quality level 允收水準(zhǔn)
ATE :automatic test equipment 自動(dòng)測(cè)試
ATM :atmosphere 氣壓
BGA :ball grid array 球形矩陣
CCD :charge coupled device 監(jiān)視連接元件(攝影機(jī))
CLCC :Ceramic leadless chip carrier 陶瓷引腳載具
COB :chip-on-board 晶片直接貼附在電路板上
cps :centipoises(黏度單位) 百分之一
CSB :chip scale ball grid array 晶片尺寸BGA
CSP :chip scale package 晶片尺寸構(gòu)裝
CTE :coefficient of thermal expansion 熱膨脹系數(shù)
DIP :dual in-line package 雙內(nèi)線包裝(泛指手插元件)
FPT :fine pitch technology 微間距技術(shù)
FR-4 :flame-retardant substrate 玻璃纖維膠片(用來(lái)製作PCB材質(zhì))
IC :integrate circuit 積體電路
IR :infra-red 紅外線
Kpa :kilopascals(壓力單位)
LCC :leadless chip carrier 引腳式晶片承載器
MCM :multi-chip module 多層晶片模組
MELF :metal electrode face 二極體
MQFP :metalized QFP 金屬四方扁平封裝
NEPCON :National Electronic Package and
Production Conference 國(guó)際電子包裝及生產(chǎn)會(huì)議
ppm:parts per million 指每百萬(wàn)PAD(點(diǎn))有多少個(gè)不良PAD(點(diǎn))
psi :pounds/inch2 磅/英吋2
PWB :printed wiring board 電路板
QFP :quad flat package 四邊平坦封裝
SIP :single in-line package
SIR :surface insulation resistance 絕緣阻抗
SMC :Surface Mount Component 表面黏著元件
SMD :Surface Mount Device 表面黏著元件
SMEMA :Surface Mount Equipment
Manufacturers Association 表面黏著設(shè)備製造協(xié)會(huì)
SMT :surface mount technology 表面黏著技術(shù)
SOIC :small outline integrated circuit
SOJ :small out-line j-leaded package
SOP :small out-line package 小外型封裝
SOT :small outline transistor 電晶體
SPC :statistical process control 統(tǒng)計(jì)過(guò)程控制
SSOP :shrink small outline package 收縮型小外形封裝
TAB :tape automaticed bonding 帶狀自動(dòng)結(jié)合
TCE :thermal coefficient of expansion 膨脹(因熱)係數(shù)
Tg :glass transition temperature 玻璃轉(zhuǎn)換溫度
THD :Through hole device 須穿過(guò)洞之元件(貫穿孔)
TQFP :tape quad flat package 帶狀四方平坦封裝
UV :ultraviolet 紫外線
uBGA :micro BGA 微小球型矩陣
cBGA :ceramic BGA 陶瓷球型矩陣
PTH :Plated Thru Hole 導(dǎo)通孔
IA Information Appliance 資訊家電產(chǎn)品
MESH 網(wǎng)目
OXIDE 氧化物
FLUX 助焊劑
LGA (Land Grid Arry)封裝技術(shù) LGA封裝不需植球，適合輕薄短小產(chǎn)品
應(yīng)用。
TCP (Tape Carrier Package)
ACF Anisotropic Conductive Film 異方性導(dǎo)電膠膜製程

Solder mask 防焊漆
Soldering Iron 烙鐵
Solder balls 錫球
Solder Splash 錫渣
Solder Skips 漏焊
Through hole 貫穿孔
Touch up 補(bǔ)焊
Briding 穚接(短路)
Solder Wires 焊錫線
Solder Bars 錫棒
Green Strength 未固化強(qiáng)度(紅膠)
Transter Pressure 轉(zhuǎn)印壓力(印刷)
Screen Printing 刮刀式印刷
Solder Powder 錫顆粒
Wetteng ability 潤(rùn)濕能力
Viscosity 黏度
Solderability 焊錫性
Applicability 使用性
Flip chip 覆晶
Depaneling Machine 組裝電路板切割機(jī)
Solder Recovery System 錫料回收再使用系統(tǒng)
Wire Welder 主機(jī)板補(bǔ)線機(jī)
X-Ray Multi-layer Inspection System X-Ray孔偏檢查機(jī)
BGA Open/Short X-Ray Inspection Machine BGA X-Ray檢測(cè)機(jī)
Prepreg Copper Foil Sheeter P.P. 銅箔裁切機(jī)
Flex Circuit Connections 軟性排線焊接機(jī)
LCD Rework Station 液晶顯示器修護(hù)機(jī)
Battery Electro Welder 電池電極焊接機(jī)
PCMCIA Card Welder PCMCIA卡連接器焊接
Laser Diode 半導(dǎo)體雷射
Ion Lasers 離子雷射
Nd: YAG Laser 石榴石雷射
DPSS Lasers 半導(dǎo)體激發(fā)固態(tài)雷射
Ultrafast Laser System 超快雷射系統(tǒng)
MLCC Equipment 積層元件生產(chǎn)設(shè)備
Green Tape Caster, Coater 薄帶成型機(jī)
ISO Static Laminator 積層元件均壓機(jī)
Green Tape Cutter 元件切割機(jī)
Chip Terminator 積層元件端銀機(jī)
MLCC Tester 積層電容測(cè)試機(jī)
Components Vision Inspection System晶片元件外觀檢查機(jī)
高壓恆溫恆濕壽命測(cè)試機(jī) High Voltage Burn-In Life Tester
電容漏電流壽命測(cè)試機(jī) Capacito